Inventor
Thomas H. Dozier, II
Inventor
Livermore, CA, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables15%
H05KPrinted circuits15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
B23KSoldering or unsoldering13%
Y10TTechnical subjects covered by former us classification12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
H01RElectrically-conductive connections4%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material1%
PatentTitleYear
8,513,969'Apparatus and method of testing singulated dies'20137,733,106'Apparatus and method of testing singulated dies'20107,714,598'Contact carriers (tiles) for populating larger substrates with spring contacts'20107,347,702'Contact carriers (tiles) for populating larger substrates with spring contacts'20087,140,883'Contact carriers (tiles) for populating larger substrates with spring contacts'20067,059,047'Sockets for “springed†semiconductor devices'20066,913,468'Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods'20056,836,962'Method and apparatus for shaping spring elements'20056,741,085'Contact carriers (tiles) for populating larger substrates with spring contacts'20046,701,612'Method and apparatus for shaping spring elements'20046,669,489'Interposer, socket and assembly for socketing an electronic component and method of making and using same'20036,642,625'Sockets for springed semiconductor devices'20036,534,856'Sockets for springed semiconductor devices'20036,442,831'Method for shaping spring elements'20026,232,149'Sockets for \"springed\" semiconductor devices'20016,150,186'Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive'20006,033,935'Sockets for \"springed\" semiconductor devices'20005,820,014'Solder preforms'19985,806,181'Contact carriers (tiles) for populating larger substrates with spring contacts'19985,772,451'Sockets for electronic components and methods of connecting to electronic components'19985,473,510'Land grid array package/circuit board assemblies and methods for constructing the same'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Patents assigned to CONVEX COMPUTER CORP (1)· patent assignee history
1995Based in Carrollton, TX, US· patent location history
1998–2013Patents assigned to FORMFACTOR INC (20)· patent assignee history
1998–2013Based in Livermore, CA, US· patent location history
1998–2005Based in Carrolton, TX, US· patent location history
2013Patents assigned to DOZIER II THOMAS H (1)· patent assignee history
2013Patents assigned to ELDRIDGE BENJAMIN N (1)· patent assignee history
2013Patents assigned to HSU DAVID H (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FORMFACTOR INC | 20 | 1998–2013 |
| CONVEX COMPUTER CORP | 1 | 1995 |
| DOZIER II THOMAS Hself | 1 | 2013 |
| ELDRIDGE BENJAMIN N | 1 | 2013 |
| HSU DAVID H | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Livermore, California, US | 13 | 1998–2013 |
| Carrolton, Texas, US | 7 | 1998–2005 |
| Carrollton, Texas, US | 1 | 1995 |