Inventor
Subhash L. Shinde
Inventor
Cortlandt Manor, NY, US
Overview
Patents· 49 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C04BLime, magnesia14%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
Y10TTechnical subjects covered by former us classification10%
H05KPrinted circuits10%
G02BOptical elements, systems or apparatus8%
C22CAlloys5%
B22FWorking metallic powder4%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace3%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
9,190,392'Three-dimensional stacked structured ASIC devices and methods of fabrication thereof'20158,913,856'Manufacturable optical connection assemblies'20148,907,439'Focal plane array with modular pixel array components for scalability'20148,089,133'Optical assemblies for transmitting and manipulating optical beams'20127,767,575'Forming robust solder interconnect structures by reducing effects of seed layer underetching'20107,544,527'Method and apparatus for providing optoelectronic communication with an electronic device'20097,473,997'Method for forming robust solder interconnect structures by reducing effects of seed layer underetching'20097,245,022'Semiconductor module with improved interposer structure and method for forming the same'20077,128,472'Method and apparatus for providing optoelectronic communication with an electronic device'20067,084,496'Method and apparatus for providing optoelectronic communication with an electronic device'20066,995,084'Method for forming robust solder interconnect structures by reducing effects of seed layer underetching'20066,836,015'Optical assemblies for transmitting and manipulating optical beams'20046,827,505'Optoelectronic package structure and process for planar passive optical and optoelectronic devices'20046,817,776'Method of bonding optical fibers and optical fiber assembly'20046,793,407'Manufacturable optical connection assemblies'20046,762,119'Method of preventing solder wetting in an optical device using diffusion of Cr'20046,652,956'X-ray printing personalization technique'20036,638,681'X-ray printing personalization technique'20036,413,339'Low temperature sintering of ferrite materials'20026,373,133'Multi-chip module and heat-sink cap combination'20026,352,014'Method for making punches using multi-layer ceramic technology'20026,306,528'Method for the controlling of certain second phases in aluminum nitride'20016,292,367'Thermally efficient semiconductor chip'20016,291,272'Structure and process for making substrate packages for high frequency application'20016,262,390'Repair process for aluminum nitride substrates'20016,200,373'Method for controlling of certain second phases in aluminum nitride'20016,096,565'Multi-layer glass ceramic module with superconductor wiring'20006,004,624'Method for the controlling of certain second phases in aluminum nitride'19996,002,951'Multi-layer ceramic substrate having high TC superconductor circuitry'19995,981,310'Multi-chip heat-sink cap assembly'19995,932,043'Method for flat firing aluminum nitride/tungsten electronic modules'19995,911,945'Method for in-situ environment sensitive sealing and/or product controlling'19995,888,446'Method of forming an aluminum nitride article utilizing a platinum catalyst'19995,773,377'Low temperature sintered, resistive aluminum nitride ceramics'19985,763,093'Aluminum nitride body having graded metallurgy'19985,755,570'Apparatus for in situ environment sensitive sealing and/or product controlling'19985,753,162'Method for in-situ environment sensitive sealing and/or product controlling'19985,682,589'Aluminum nitride body having graded metallurgy'19975,628,849'Method for in-situ environment sensitive sealing and/or product controlling'19975,552,107'Aluminum nitride body having graded metallurgy'19965,552,232'Aluminum nitride body having graded metallurgy'19965,541,145'Low temperature sintering route for aluminum nitride ceramics'19965,520,878'Aluminum nitride body and method for forming said body utilizing a vitreous sintering additive'19965,482,903'Aluminum nitride body utilizing a vitreous sintering additive'19965,424,261'Low temperature sintering route for aluminum nitride ceramics'19955,304,517'Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering'19945,296,189'Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith'19945,292,477'Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith'19945,218,296'Method and apparatus for determining at least one characteristic of a superconductive film'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2014Patents assigned to IBM (44)· patent assignee history
1993–1999Based in Croton-on-Hudson, NY, US· patent location history
1995–1998Patents assigned to CARBORUNDUM CO (5)· patent assignee history
1998–1999Patents assigned to CRYSTALLINE MATERIALS CORP (2)· patent assignee history
1998–2004Based in Cortland, NY, US· patent location history
1999–2014Based in Cortlandt Manor, NY, US· patent location history
1999–2010Based in Pelham Manor, NY, US· patent location history
2012–2014Patents assigned to SHINDE SUBHASH L (3)· patent assignee history
2014–2015Patents assigned to SANDIA CORP (2)· patent assignee history
2014–2015Based in Albuquerque, NM, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 44 | 1993–2014 |
| CARBORUNDUM CO | 5 | 1995–1998 |
| SHINDE SUBHASH Lself | 3 | 2012–2014 |
| CRYSTALLINE MATERIALS CORP | 2 | 1998–1999 |
| SANDIA CORP | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cortlandt Manor, New York, US | 19 | 1999–2014 |
| Croton-on-Hudson, New York, US | 16 | 1993–1999 |
| Cortland, New York, US | 6 | 1998–2004 |
| Pelham Manor, New York, US | 4 | 1999–2010 |
| Albuquerque, NM, US | 2 | 2014–2015 |