Inventor

Sidharth Dalmia

Inventor
Fair Oaks, CA, US

Overview

30→
Patents
2005–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01FMagnets15%
H05KPrinted circuits12%
H01QAntennas, i.e. radio aerials9%
H01LSemiconductor devices7%
H01PWaveguides7%
Y10TTechnical subjects covered by former us classification7%
H03HImpedance networks, e.g. resonant circuits6%
H10DInorganic electric semiconductor devices6%
B29CShaping or joining of plastics2%
PatentTitleYear
11,121,468Antenna modules and communication devices202111,024,574Integrated substrate communication frontend202111,011,827Antenna boards and communication devices202110,797,394Antenna modules and communication devices202010,756,033Wireless module with antenna package and cap package202010,741,932Compact radio frequency (RF) communication modules with endfire and broadside antennas202010,566,298Package on antenna package202010,332,821Partially molded direct chip attach package structures for connectivity module solutions201910,186,756Antennas in electronic devices201910,049,961Partially molded direct chip attach package structures for connectivity module solutions20189,440,378'Planar electronic device and method for manufacturing'20169,201,104'Intelligent power sensing device'20159,113,570'Planar electronic device having a magnetic component'20159,070,509'Method for manufacturing a planar electronic device having a magnetic component'20158,823,480'Planar electronic device'20148,466,769'Planar inductor devices'20138,358,193'Planar inductor devices'20138,345,433'Heterogeneous organic laminate stack ups for high frequency applications'20138,203,418'Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors'20128,013,688'Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications'20117,989,895'Integration using package stacking with multi-layer organic substrates'20117,808,434'Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices'20107,805,834'Method for fabricating three-dimensional all organic interconnect structures'20107,795,995'Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications'20107,489,914'Multi-band RF transceiver with passive reuse in organic substrates'20097,439,840'Methods and apparatuses for high-performing multi-layer inductors'20087,260,890'Methods for fabricating three-dimensional all organic interconnect structures'20077,068,124'Integrated passive devices fabricated utilizing multi-layer, organic laminates'20066,987,307'Stand-alone organic-based passive devices'20066,900,708'Integrated passive devices fabricated utilizing multi-layer, organic laminates'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2011Patents assigned to GEORGIA TECH RES INST (8)· patent assignee history
2005–2010Based in Alpharetta, GA, US· patent location history
2008–2013Based in Norcross, GA, US· patent location history
2012–2016Patents assigned to DALMIA SIDHARTH (7)· patent assignee history
2013–2016Patents assigned to TYCO ELECTRONICS CORP (6)· patent assignee history
2013–2021Based in Fair Oaks, CA, US· patent location history
2015Based in Thousands Oaks, CA, US· patent location history
2018–2021Patents assigned to INTEL IP CORP (7)· patent assignee history
2020–2021Patents assigned to INTEL CORP (4)· patent assignee history
2020–2021Based in Portland, OR, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GEORGIA TECH RES INST82005–2011
DALMIA SIDHARTHself72012–2016
INTEL IP CORP72018–2021
TYCO ELECTRONICS CORP62013–2016
INTEL CORP42020–2021
Locations
LocationPatentsSpan
Fair Oaks, California, US112013–2021
Norcross, Georgia, US72008–2013
Portland, OR, US52020–2021
Alpharetta, Georgia, US52005–2010
Thousands Oaks, California, US12015