Inventor
Shou-Zen Chang
Inventor
Hsinchu, TW
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10DInorganic electric semiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H01QAntennas, i.e. radio aerials9%
G06VImage or video recognition or understanding1%
B81BMicrostructural devices or systems, e.g. micromechanical devices1%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems1%
G06FElectric digital data processing1%
G11CStatic stores1%
PatentTitleYear
11,011,433NMOS and PMOS transistor gates with hafnium oxide layers and lanthanum oxide layers202111,004,688FinFET device and method of forming202110,991,826Semiconductor device and methods of forming same202110,950,603Semiconductor device and method202110,937,910Semiconductor structure with source/drain multi-layer structure and method for forming the same202110,930,781P-type strained channel in a fin field effect transistor (FinFET) device202110,868,004Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof202010,867,940Package structure and manufacturing method thereof202010,825,508Bit line structure for two-transistor static random access memory202010,727,082Semiconductor device and manufacturing method thereof202010,636,713Semiconductor packages and manufacturing methods thereof202010,535,913Package structure, electronic device and method of fabricating package structure202010,515,956Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof201910,510,714Packaged semiconductor devices and packaging methods201910,510,681Semiconductor device201910,483,617Package structure201910,475,757Package structure and manufacturing method thereof201910,354,964Integrated devices in semiconductor packages and methods of forming same201910,312,203Structure and formation method of chip package with antenna element201910,304,790Method of fabricating an integrated fan-out package201910,276,920Package structure, electronic device and method of fabricating package structure201910,183,858Semiconductor structure and method of manufacturing the same201910,186,492Package structure and manufacturing method thereof201910,163,824Integrated fan-out package and method of fabricating the same201810,163,854Package structure and method for manufacturing thereof201810,157,807Sensor packages and manufacturing mehtods thereof201810,157,859Semiconductor device structure201810,050,013Packaged semiconductor devices and packaging methods201810,043,761Semiconductor device and manufacturing method thereof201810,037,994Semiconductor devices having Fin field effect transistor (FinFET) structures and manufacturing and design methods thereof20189,978,630Curved wafer processing method and apparatus20189,875,972Semiconductor device structure and method for forming the same20189,818,745'Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof'20179,818,722'Package structure and method for manufacturing thereof'20179,661,794'Method of manufacturing package structure'20179,601,439'Semiconductor structure and manufacturing method thereof'20179,373,549'Semiconductor device and method of forming the same'20169,362,123'Structure and method for integrated devices on different substartes with interfacial engineering'20169,236,253'Strained structure of a semiconductor device'20169,105,744'Semiconductor devices having inactive fin field effect transistor (FinFET) structures and manufacturing and design methods thereof'20159,054,188'Curved wafer processing on method and apparatus'20158,759,920'Semiconductor device and method of forming the same'20148,754,486'IO ESD device and methods for forming the same'20148,551,841'IO ESD device and methods for forming the same'20138,524,554'Semiconductor device and method for fabricating the same'20138,313,993'Semiconductor device and method for fabricating the same'20128,012,827'Method for fabricating a dual workfunction semiconductor device and the device made thereof'20117,989,898'Method for fabricating a dual workfunction semiconductor device and the device made thereof'20117,759,748'Semiconductor device with reduced diffusion of workfunction modulating element'20107,117,460'Method for physical parameter extraction for transistor model'20066,303,448'Method for fabricating raised source/drain structures'20016,121,139'Ti-rich TiN insertion layer for suppression of bridging during a salicide procedure'20006,037,204'Silicon and arsenic double implanted pre-amorphization process for salicide technology'20006,030,863'Germanium and arsenic double implanted pre-amorphization process for salicide technology'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (17)· patent assignee history
2000–2020Based in Hsinchu, TW· patent location history
2006–2019Based in Pan-Chiao, TW· patent location history
2010–2013Patents assigned to IMEC (5)· patent assignee history
2010Based in Tervuren, BE· patent location history
2012–2015Patents assigned to CHANG SHOU-ZEN (4)· patent assignee history
2013–2015Patents assigned to CHANG CHIH-HAO (4)· patent assignee history
2017–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (35)· patent assignee history
2017–2021Based in Taipei, TW· patent location history
2017–2020Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 35 | 2017–2021 |
| TAIWAN SEMICONDUCTOR MFG | 17 | 2000–2016 |
| IMEC | 5 | 2010–2013 |
| CHANG CHIH-HAO | 4 | 2013–2015 |
| CHANG SHOU-ZENself | 4 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 23 | 2000–2020 |
| Pan-Chiao, TW | 14 | 2006–2019 |
| Taipei, TW | 10 | 2017–2021 |
| New Taipei, TW | 6 | 2017–2020 |
| Tervuren, BE | 1 | 2010 |