Inventor
Elke Zakel
Inventor
Falkensee, DE
Overview
Patents· 45 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
B23KSoldering or unsoldering19%
H05KPrinted circuits15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y10TTechnical subjects covered by former us classification3%
G01RMeasuring electric variables2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling1%
C04BLime, magnesia1%
C25DProcesses for the electrolytic or electrophoretic production of coatings1%
F26BDrying solid materials or objects by removing liquid therefrom1%
PatentTitleYear
9,401,298'Method and device for transferring a chip to a contact substrate'20168,742,571'Diode array and method for producing a diode array'20148,497,578'Terminal face contact structure and method of making same'20138,431,477'Method for joining aligned discrete optical elements'20138,361,881'Method for alternately contacting two wafers'20138,256,131'Method and device for drying circuit substrates'20127,932,611'Device for alternately contacting two wafers'20117,926,699'Method and device for transferring a solder deposit configuration'20117,882,997'Method and device for mutual contacting of two wafers'20117,829,817'Device for removing solder material from a soldered joint'20107,762,446'Method and device for transferring a solder deposit configuration'20107,481,352'Method for ablating points of contact (debumping)'20097,121,449'Method and device for applying material to a workpiece'20067,087,442'Process for the formation of a spatial chip arrangement and spatial chip arrangement'20067,049,213'Method for producing a contact substrate and corresponding contact substrate'20067,021,517'Method and device for applying pieces of material to a workpiece'20067,007,834'Contact bump construction for the production of a connector construction for substrate connecting surfaces'20066,955,943'Method for producing a substrate arrangement'20056,955,284'Device for positioning a tool in relation to a workpiece'20056,915,940'Device for applying solder globules'20056,720,257'Bump with basic metallization and method for manufacturing the basic metallization'20046,651,891'Method for producing contactless chip cards and corresponding contactless chip card'20036,478,906'Method for bonding a flexible substrate to a chip'20026,407,457'Contact-bumpless chip contacting method and an electronic circuit produced by said method'20026,285,562'Method of contacting a chip'20016,284,639'Method for forming a structured metallization on a semiconductor wafer'20016,281,577'Chips arranged in plurality of planes and electrically connected to one another'20016,277,660'Method and apparatus for testing chips'20016,211,571'Method and apparatus for testing chips'20016,160,218'Chip housing'20006,153,940'Core metal soldering knob flip-chip technology'20006,107,118'Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way'20006,093,971'Chip module with conductor paths on the chip bonding side of a chip carrier'20006,070,788'Method of soldering terminal faces, as well as a method of manufacturing a solder alloy'20006,043,985'Thermal connecting structure for connecting materials with different expansion coefficients'20006,012,625'Process and device for forming raised metallised contacts'20005,989,993'Method for galvanic forming of bonding pads'19995,976,302'Method of joining electronic components to a substrate'19995,956,232'Chip support arrangement and chip support for the manufacture of a chip casing'19995,928,458'Flip chip bonding with non conductive adhesive'19995,906,312'Solder bump for flip chip assembly and method of its fabrication'19995,845,838'Process for remelting a contact surface metallization'19985,833,128'Flux-free contacting of components'19985,785,234'Method of surface-contacting electronic components'19984,973,389'Process for making a high temperature-resistant metal layer on a ceramic surface'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2001Based in Berlin, DE· patent location history
1998–2013Patents assigned to FRAUNHOFER GES FORSCHUNG (17)· patent assignee history
1998–2016Based in Falkensee, DE· patent location history
1999–2013Patents assigned to PAC TECH GMBH (14)· patent assignee history
1999–2016Patents assigned to ZAKEL ELKE (9)· patent assignee history
2002–2010Patents assigned to SMART PAC GMBH TECHNOLOGY SERV (4)· patent assignee history
2005Based in Falkenssee, DE· patent location history
2010–2014Based in Nauen, DE· patent location history
2012–2016Patents assigned to AZDASHT GHASSEM (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FRAUNHOFER GES FORSCHUNG | 17 | 1998–2013 |
| PAC TECH GMBH | 14 | 1999–2013 |
| ZAKEL ELKEself | 9 | 1999–2016 |
| AZDASHT GHASSEM | 4 | 2012–2016 |
| SMART PAC GMBH TECHNOLOGY SERV | 4 | 2002–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Falkensee, DE | 33 | 1998–2016 |
| Berlin, DE | 8 | 1990–2001 |
| Nauen, DE | 3 | 2010–2014 |
| Falkenssee, DE | 1 | 2005 |