Inventor
Tung-Hsien Hsieh
Inventor
Changhua County, TW
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H01LSemiconductor devices21%
H05KPrinted circuits12%
G01BMeasuring length, thickness or similar linear dimensions9%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling6%
B23BTurning3%
G01MTesting static or dynamic balance of machines or structures3%
G05BControl or regulating systems in general3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
PatentTitleYear
10,571,259Optical detecting apparatus for detecting a degree of freedom error of a spindle and a detecting method thereof202010,224,287Semiconductor device and wafer level package including such semiconductor device201910,147,674Semiconductor package assembly201810,079,192Semiconductor chip package assembly with improved heat dissipation performance20189,704,808'Semiconductor device and wafer level package including such semiconductor device'20179,704,785'Semiconductor package with die paddle'20179,704,792'Semiconductor package assembly'20179,331,054'Semiconductor package assembly with decoupling capacitor'20169,244,458'Method of numerical-control scraping of a work piece'20168,288,870'Semiconductor chip package and method for designing the same'20128,084,853'Semiconductor flip chip package utilizing wire bonding for net switching'20118,044,496'QFN semiconductor package'20118,039,319'Method for fabricating QFN semiconductor package'20118,039,933'QFN semiconductor package'20117,884,481'Semiconductor chip package and method for designing the same'20117,786,557'QFN Semiconductor package'20107,773,234'Means for measuring a working machine\'s structural deviation from five reference axes'20107,636,170'Static/dynamic multi-function measuring device for linear unit'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2020Patents assigned to UNIV NAT FORMOSA (4)· patent assignee history
2009–2010Based in Taichung, TW· patent location history
2010–2019Patents assigned to MEDIATEK INC (14)· patent assignee history
2010–2012Based in Changhua County, TW· patent location history
2011–2016Patents assigned to HSIEH TUNG-HSIEN (3)· patent assignee history
2016Patents assigned to CHEN CHIA-HUNG (1)· patent assignee history
2016Patents assigned to HUANG CHIN-HUI (1)· patent assignee history
2016–2018Based in Zhubei City, TW· patent location history
2016–2020Based in Yunlin County, TW· patent location history
2017–2019Based in Hsinchu County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEDIATEK INC | 14 | 2010–2019 |
| UNIV NAT FORMOSA | 4 | 2009–2020 |
| HSIEH TUNG-HSIENself | 3 | 2011–2016 |
| CHEN CHIA-HUNG | 1 | 2016 |
| HUANG CHIN-HUI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Changhua County, TW | 7 | 2010–2012 |
| Zhubei City, TW | 4 | 2016–2018 |
| Hsinchu County, TW | 3 | 2017–2019 |
| Yunlin County, TW | 2 | 2016–2020 |
| Taichung, TW | 2 | 2009–2010 |