Inventor
Daniel Richter
Inventor
Bad Abbach, DE
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
H10DInorganic electric semiconductor devices7%
A61NElectrotherapy5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B01LChemical or physical laboratory apparatus for general use2%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
PatentTitleYear
11,038,090Method of producing an optoelectronic component202110,832,921Electronic device with top side pin array and manufacturing method thereof202010,734,343Method and system for packing optimization of semiconductor devices202010,622,494Optoelectronic component and method of producing an optoelectronic component202010,510,935Optoelectronic component having a lead frame with a stiffening structure201910,304,697Electronic device with top side pin array and manufacturing method thereof201910,192,756Method of machining a lead frame, and lead frame20199,922,907'Electronic component, leadframe, and method for producing an electronic component'20189,533,300'Delivery system for analytical samples'20179,478,489'Semiconductor dies with reduced area consumption'20169,018,593'Irradiation method and device for carrying out the method'20158,884,243'Radiation phantom'20148,664,025'Substrate dicing technique for separating semiconductor dies with reduced area consumption'20147,824,613'Delivering samples to and controlling analytical instruments'20107,491,556'Efficient method of forming and assembling a microelectronic chip including solder bumps'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2016Based in Radebeul, DE· patent location history
2010–2017Based in Aransas Pass, TX, US· patent location history
2014–2015Patents assigned to RICHTER DANIEL (3)· patent assignee history
2014–2015Patents assigned to BERT CHRISTOPH (2)· patent assignee history
2014–2016Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2014–2015Based in Darmstadt, DE· patent location history
2018–2019Patents assigned to OSRAM OPTO SEMICONDUCTORS GMBH (3)· patent assignee history
2018–2021Based in Bad Abbach, DE· patent location history
2019–2020Patents assigned to AMKOR TECHNOLOGY INC (3)· patent assignee history
2019–2020Based in Goldsboro, NC, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 3 | 2019–2020 |
| OSRAM OPTO SEMICONDUCTORS GMBH | 3 | 2018–2019 |
| RICHTER DANIELself | 3 | 2014–2015 |
| BERT CHRISTOPH | 2 | 2014–2015 |
| GLOBALFOUNDRIES INC | 2 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Bad Abbach, DE | 5 | 2018–2021 |
| Goldsboro, NC, US | 3 | 2019–2020 |
| Radebeul, DE | 3 | 2009–2016 |
| Aransas Pass, Texas, US | 2 | 2010–2017 |
| Darmstadt, DE | 2 | 2014–2015 |