Inventor
Ji-Seok Hong
Inventor
Seoul, KR
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H05KPrinted circuits10%
B23KSoldering or unsoldering7%
H05BElectric heating5%
H10DInorganic electric semiconductor devices5%
F21VFunctional features or details of lighting devices or systems thereof2%
G05BControl or regulating systems in general2%
G06NComputing arrangements based on specific computational models2%
PatentTitleYear
10,973,103Presence and directional motion detection202110,790,264Semiconductor package20209,159,659'Semiconductor package and method of manufacturing the semiconductor package'20159,054,228'Semiconductor packages including a heat spreader and methods of forming the same'20158,958,011'Bi-directional camera module and flip chip bonder including the same'20158,940,557'Method of fabricating wafer level package'20158,901,727'Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages'20148,816,509'Semiconductor package including underfill layers'20148,664,762'Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package'20148,552,546'Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure'20138,536,045'Reflow method'20138,420,989'Coil and semiconductor apparatus having the same'20138,324,522'Reflow apparatus, reflow method, and package apparatus'20128,288,210'Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package'20128,254,140'Mounting substrate'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (14)· patent assignee history
2012–2014Patents assigned to HONG JI-SEOK (6)· patent assignee history
2012–2014Patents assigned to LEE JONG-GI (3)· patent assignee history
2012–2014Patents assigned to PARK SANG-WOOK (3)· patent assignee history
2012–2013Patents assigned to KIM MINILL (2)· patent assignee history
2012–2015Based in Seoul, KR· patent location history
2013Based in Hwaseong-si, KR· patent location history
2013Based in Gyeonggi-do, KR· patent location history
2014–2020Based in Yongin-si, KR· patent location history
2021Based in Mountain View, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 14 | 2012–2020 |
| HONG JI-SEOKself | 6 | 2012–2014 |
| LEE JONG-GI | 3 | 2012–2014 |
| PARK SANG-WOOK | 3 | 2012–2014 |
| KIM MINILL | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 7 | 2012–2015 |
| Yongin-si, KR | 5 | 2014–2020 |
| Mountain View, California, US | 1 | 2021 |
| Hwaseong-si, KR | 1 | 2013 |
| Gyeonggi-do, KR | 1 | 2013 |