Inventor
Roy H. Magnuson
Inventor
Endicott, NY, US
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
Y10TTechnical subjects covered by former us classification18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
C23CCoating metallic material8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
C23FNon-mechanical removal of metallic material from surface3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
PatentTitleYear
10,881,135Cyclonically cooled and filtered smoking water pipe and method202110,064,283Embedded thin films20189,451,693'Electrically conductive adhesive (ECA) for multilayer device interconnects'20168,882,983'Embedded thin films'20148,685,284'Conducting paste for device level interconnects'20147,738,249'Circuitized substrate with internal cooling structure and electrical assembly utilizing same'20107,713,767'Method of making circuitized substrate with internal optical pathway using photolithography'20107,679,005'Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same'20107,635,552'Photoresist composition with antibacterial agent'20097,566,939'Fabrication of silicon micro-mechanical structures'20097,541,058'Method of making circuitized substrate with internal optical pathway'20097,442,879'Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate'20087,353,590'Method of forming printed circuit card'20087,169,313'Plating method for circuitized substrates'20076,986,198'Method of forming printed circuit card'20066,949,397'Fabrication of silicon micro mechanical structures'20056,852,152'Colloidal seed formulation for printed circuit board metallization'20056,750,405'Two signal one power plane circuit board'20046,699,350'Dielectric structure and method of formation'20046,630,743'Copper plated PTH barrels and methods for fabricating'20036,495,239'Dielectric structure and method of formation'2002RE037840'Method of preparing a printed circuit board'20026,436,803'Manufacturing computer systems with fine line circuitized substrates'20026,268,016'Manufacturing computer systems with fine line circuitized substrates'20016,228,246'Removal of metal skin from a copper-Invar-copper laminate'20016,204,453'Two signal one power plane circuit board'20016,201,194'Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric'20016,179,990'Biased acid cleaning of a copper-invar-copper laminate'20015,557,844'Method of preparing a printed circuit board'19965,487,218'Method for making printed circuit boards with selectivity filled plated through holes'19965,427,895'Semi-subtractive circuitization'19954,967,690'Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means'19904,948,707'Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon'19904,904,506'Copper deposition from electroless plating bath'19904,684,545'Electroless plating with bi-level control of dissolved oxygen'19874,666,858'Determination of amount of anionic material in a liquid sample'19874,623,554'Method for controlling plating rate in an electroless plating system'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2009Patents assigned to IBM (25)· patent assignee history
1986–1990Based in Binghamton, NY, US· patent location history
1990–2018Based in Endicott, NY, US· patent location history
2007–2014Patents assigned to ENDICOTT INTERCONNECT TECH INC (7)· patent assignee history
2014–2016Patents assigned to DAS RABINDRA N (2)· patent assignee history
2014–2016Patents assigned to MAGNUSON ROY H (2)· patent assignee history
2014–2016Patents assigned to MARKOVICH VOYA R (2)· patent assignee history
2021Based in Spokane, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 25 | 1986–2009 |
| ENDICOTT INTERCONNECT TECH INC | 7 | 2007–2014 |
| DAS RABINDRA N | 2 | 2014–2016 |
| MAGNUSON ROY Hself | 2 | 2014–2016 |
| MARKOVICH VOYA R | 2 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 31 | 1990–2018 |
| Binghamton, New York, US | 5 | 1986–1990 |
| Spokane, Washington, US | 1 | 2021 |