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Inventor

TOSHIKI MIYAKAWA

Inventor
JP

Overview

2→
Patents
2024–2025
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing50%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
PatentTitleYear
12,325,101Polishing apparatus and polishing method202512,083,646Polishing apparatus, polishing method and method for outputting visualization information of film thickness distribution on substrate2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024–2025Patents assigned to EBARA CORP (2)· patent assignee history
2024–2025Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP22024–2025
Locations
LocationPatentsSpan
JP22024–2025