Inventor
Bongju Cho
Inventor
KR
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
PatentTitleYear
12,593,684Semiconductor package including heat dissipation structure202612,525,526Semiconductor package and method of manufacturing the semiconductor package202612,519,051Semiconductor package device202612,394,708Semiconductor package202512,278,191Semiconductor packages having wiring patterns202512,261,105Semiconductor package202512,119,305Semiconductor package202412,057,380Semiconductor package202412,046,562Semiconductor package202412,021,020Semiconductor package202411,935,847Semiconductor package202411,837,537Fan-out semiconductor package202311,721,620Fan-out type semiconductor package202311,569,158Semiconductor package202311,569,175Semiconductor package202311,562,966Semiconductor package202311,398,420Semiconductor package having core member and redistribution substrate202211,329,014Semiconductor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (18)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 18 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 18 | 2022–2026 |