Inventor
Wei Yeeng Ng
Inventor
Boise, ID, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10BElectronic memory devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
10,707,121Solid state memory device, and manufacturing method thereof202010,580,782Methods of forming an array of elevationally-extending strings of memory cells individually comprising a programmable charge-storage transistor202010,304,749Method and apparatus for improved etch stop layer or hard mask layer of a memory device2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2020Patents assigned to INTEL CORP (2)· patent assignee history
2019–2020Based in Boise, ID, US· patent location history
2020Patents assigned to MICRON TECHNOLOGY INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 2 | 2019–2020 |
| MICRON TECHNOLOGY INC | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 3 | 2019–2020 |