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Inventor

Lin Chen

Inventor
Shanghai, CN

Overview

3→
Patents
2011–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
G06VImage or video recognition or understanding13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
10,510,858Method to improve HKMG contact resistance20199,508,873'Schottky diode and method of fabricating the same'20167,953,257'Sliding type thin fingerprint sensor package'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011Patents assigned to CHIPBOND TECHNOLOGY CORP (1)· patent assignee history
2011Based in Kaohsiung, TW· patent location history
2016Patents assigned to ELECTRONICS & TELECOMMUNICATIONS RES INST (1)· patent assignee history
2016Patents assigned to NAT SCIENCE FOUND (1)· patent assignee history
2016Based in Ann Arbor, MI, US· patent location history
2019Patents assigned to SEMICONDUCTOR MFG INT BEIJING CORP (1)· patent assignee history
2019Patents assigned to SEMICONDUCTOR MFG INT SHANGHAI CORP (1)· patent assignee history
2019Based in Shanghai, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP12011
ELECTRONICS & TELECOMMUNICATIONS RES INST12016
NAT SCIENCE FOUND12016
SEMICONDUCTOR MFG INT BEIJING CORP12019
SEMICONDUCTOR MFG INT SHANGHAI CORP12019
Locations
LocationPatentsSpan
Shanghai, CN12019
Ann Arbor, MI, US12016
Kaohsiung, TW12011