Inventor
Amirul Afiq Hud
Inventor
Melaka, MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H02KDynamo-electric machines7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
PatentTitleYear
10,699,978SMD package with top side cooling202010,373,897Semiconductor devices with improved thermal and electrical performance201910,204,845Semiconductor chip package having a repeating footprint pattern201910,147,703Semiconductor package for multiphase circuitry device201810,083,899Semiconductor package with heat slug and rivet free die attach area20189,972,576Semiconductor chip package comprising side wall marking2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (4)· patent assignee history
2018Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2018–2020Based in Melaka, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AUSTRIA AG | 4 | 2018–2020 |
| INFINEON TECHNOLOGIES AG | 2 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 6 | 2018–2020 |