Inventor
Douglas E. Heckaman
Inventor
Indialantic, FL, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Pprimary
H01PWaveguides34%
H01QAntennas, i.e. radio aerials23%
H05KPrinted circuits17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
G02BOptical elements, systems or apparatus3%
H01RElectrically-conductive connections3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
6,535,397'Interconnect structure for interconnecting electronic modules'20036,421,012'Phased array antenna having patch antenna elements with enhanced parasitic antenna element performance at millimeter wavelength radio frequency signals'20026,271,799'Antenna horn and associated methods'20016,266,015'Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit'20016,166,705'Multi title-configured phased array antenna architecture'20006,130,585'Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks'20006,097,260'Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks'20006,028,494'High isolation cross-over for canceling mutually coupled signals between adjacent stripline signal distribution networks'20005,835,062'Flat panel-configured electronically steerable phased array antenna having spatially distributed array of fanned dipole sub-arrays controlled by triode-configured field emission control devices'19985,309,125'Compact delay line formed of concentrically stacked, helically grooved, cylindrical channel-line structure'19945,272,457'High isolation integrated switch circuit'19935,218,373'Hermetically sealed waffle-wall configured assembly including sidewall and cover radiating elements and a base-sealed waveguide window'19935,124,677'Waffleline-configured surface-mount package for high frequency signal coupling applications'19925,122,475'Method of making a high speed, high density semiconductor memory package with chip level repairability'19925,065,123'Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies'19915,023,624'Microwave chip carrier package having cover-mounted antenna element'19915,014,114'High speed, high density semiconductor memory package with chip level repairability'19914,956,621'Three-state, two-output variable RF power divider'19904,951,011'Impedance matched plug-in package for high speed microwave integrated circuits'19904,890,195'Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing'19894,851,793'Waffleline - configured transmission link'19894,695,810'Waffleline-configured microwave transmission link'19874,641,140'Miniaturized microwave transmission link'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2003Patents assigned to HARRIS CORP (23)· patent assignee history
1987–2003Based in Indialantic, FL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HARRIS CORP | 23 | 1987–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Indialantic, Florida, US | 23 | 1987–2003 |