Inventor
HSIN-WEI TSENG
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices22%
H10NElectric solid-state devices not otherwise provided for22%
G11CStatic stores11%
H01LSemiconductor devices11%
C23CCoating metallic material6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H01JElectric discharge tubes or discharge lamps6%
H10DInorganic electric semiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
12,075,628Magnetic memory devices and methods of formation202411,818,959Methods for forming structures for MRAM applications202311,374,170Methods to form top contact to a magnetic tunnel junction202211,251,024Coating for chamber particle reduction202211,239,086Back end memory integration process2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to APPLIED MATERIALS INC (5)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2024 |