Inventor
Ruoyu Wang
Inventor
Chengdu, CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering14%
C21DModifying the physical structure of ferrous metals14%
E01BPermanent way14%
H01LSemiconductor devices14%
H01QAntennas, i.e. radio aerials14%
H04NPictorial communication, e.g. television14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Patents assigned to MICROSOFT CORPORATE (1)· patent assignee history
2002Based in Urbana, IL, US· patent location history
2019Patents assigned to IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROELEKTRON (1)· patent assignee history
2019Patents assigned to IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROE (1)· patent assignee history
2019Based in Frankfurt am Main, DE· patent location history
2020Patents assigned to PANGANG GROUP RES INSTITUTE CO LTD (1)· patent assignee history
2020Based in Chengdu, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROELEKTRON | 1 | 2019 |
| IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUR INNOVATIVE MIKROE | 1 | 2019 |
| MICROSOFT CORPORATE | 1 | 2002 |
| PANGANG GROUP RES INSTITUTE CO LTD | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chengdu, CN | 1 | 2020 |
| Frankfurt am Main, DE | 1 | 2019 |
| Urbana, Illinois, US | 1 | 2002 |