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Inventor

Akitaka Makino

Inventor
Hikari, JP

Overview

28→
Patents
1995–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1038%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests20%
H01JElectric discharge tubes or discharge lamps18%
C23FNon-mechanical removal of metallic material from surface4%
H01LSemiconductor devices4%
H05HPlasma technique4%
LOC134%
C23CCoating metallic material2%
F16KValves2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
10,103,007Plasma processing apparatus with gas feed and evacuation conduit20188,897,906'Wafer processing based on sensor detection and system learning'20148,740,011'Vacuum processing apparatus'20148,569,177'Plasma processing apparatus and plasma processing method'20138,460,467'Vacuum processing apparatus'20138,286,822'Vacuum processing apparatus'20128,216,420'Plasma processing apparatus'20128,148,268'Plasma treatment apparatus and plasma treatment method'20128,100,620'Vacuum processing apparatus'20128,048,259'Vacuum processing apparatus'20117,976,632'Vacuum processing apparatus'20117,833,382'Vacuum processing apparatus'20107,828,928'Vacuum processing apparatus'20107,807,581'Plasma processing apparatus and plasma processing method'20107,674,351'Plasma processing apparatus'20107,641,069'Vacuum processing apparatus'20107,416,633'Plasma processing apparatus'20087,335,277'Vacuum processing apparatus'20087,322,561'Vacuum processing apparatus'2008D0557425'Cover ring for a plasma processing apparatus'2007D0557226'Electrode cover for a plasma processing apparatus'2007D0556704'Grounded electrode for a plasma processing apparatus'20077,247,207'Vacuum processing apparatus'20077,194,821'Vacuum processing apparatus and vacuum processing method'20076,850,012'Plasma processing apparatus'20055,607,510'Vacuum processing apparatus'19975,458,687'Method of and apparatus for securing and cooling/heating a wafer'19955,391,260'Vacuum processing apparatus'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–1997Patents assigned to HITACHI LTD (3)· patent assignee history
1995–1997Based in Kudamatsu, JP· patent location history
2005–2018Patents assigned to HITACHI HIGH TECH CORP (25)· patent assignee history
2005–2014Based in Hikari, JP· patent location history
2012–2014Patents assigned to MAKINO AKITAKA (8)· patent assignee history
2012–2014Patents assigned to TAUCHI SUSUMU (4)· patent assignee history
2013–2014Patents assigned to KIHARA HIDEKI (2)· patent assignee history
2018Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI HIGH TECH CORP252005–2018
MAKINO AKITAKAself82012–2014
TAUCHI SUSUMU42012–2014
HITACHI LTD31995–1997
KIHARA HIDEKI22013–2014
Locations
LocationPatentsSpan
Hikari, JP242005–2014
Kudamatsu, JP31995–1997
Tokyo, JP12018