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Inventor

JUNG-CHIN WU

Inventor
TW

Overview

3→
Patents
2022–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form33%
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B29LIndexing scheme associated with subclass b29c, relating to particular articles17%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
12,122,123Composite material structure and manufacturing method thereof202411,794,447Composite material structure202311,478,966Composite plate structure and manufacturing method thereof2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to COMPAL ELECTRONICS INC (3)· patent assignee history
2022–2024Patents assigned to HUANG HAN CHING (3)· patent assignee history
2022–2024Patents assigned to LEE SHENG HUNG (3)· patent assignee history
2022–2024Patents assigned to LING KUO NAN (3)· patent assignee history
2022–2024Patents assigned to WU JUNG CHIN (3)· patent assignee history
2022–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
COMPAL ELECTRONICS INC32022–2024
HUANG HAN CHING32022–2024
LEE SHENG HUNG32022–2024
LING KUO NAN32022–2024
WU JUNG CHINself32022–2024
Locations
LocationPatentsSpan
TW32022–2024