Inventor
YUICHI NAKAMURA
Inventor
JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H02Kprimary
H02KDynamo-electric machines11%
H01LSemiconductor devices9%
H05KPrinted circuits7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling5%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them5%
H02NElectric machines not otherwise provided for5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B63BShips or other waterborne vessels4%
G01SRadio direction-finding4%
PatentTitleYear
12,566,436Maneuvering control devices for vessels, vessels202612,532,705Substrate fixing device202612,493,119Detection device202512,432,451Flexible printed circuit board and image stabilization module202512,237,718Core, stator, and rotating electric device202512,207,400Metal component and ceramic substrate202512,119,707Rotary electric machine cores with reference position marks202411,996,731Core, stator, and rotating electric device202411,961,754Substrate fixing device202411,935,801Electronic component built-in wiring board and method for manufacturing the same202411,933,183Steam turbine valve abnormality monitoring system, steam turbine valve drive device, steam turbine valve device, and steam turbine plant202411,894,720Core, stator and rotating electrical machine202411,888,351Core, stator, and rotary electric machine202411,770,034Core for, rotating electrical machine202311,657,944Flexible printed circuit board and image stabilization module202311,500,844Synthetic data creation for dynamic program analysis202211,458,913Wiring module including a power supply branch part202211,456,200Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate202211,437,290Electronic component built-in wiring board and method for manufacturing the same202211,298,908Lid forming device202211,160,168Electronic component built-in wiring board and method for manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBIDEN CO LTD (3)· patent assignee history
2021–2026Based in JP· patent location history
2022–2025Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (9)· patent assignee history
2022–2026Patents assigned to SHINKO ELECTRIC IND CO (4)· patent assignee history
2023–2025Patents assigned to SUMITOMO ELECTRIC SINTERED ALLOY LTD (5)· patent assignee history
2025–2026Patents assigned to HONDA MOTOR CO LTD (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUMITOMO ELECTRIC INDUSTRIES | 9 | 2022–2025 |
| SUMITOMO ELECTRIC SINTERED ALLOY LTD | 5 | 2023–2025 |
| SHINKO ELECTRIC IND CO | 4 | 2022–2026 |
| IBIDEN CO LTD | 3 | 2021–2024 |
| HONDA MOTOR CO LTD | 2 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 21 | 2021–2026 |