Inventor
Yi-Sha Ku
Inventor
Hsinchu, TW
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions24%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
G01NInvestigating or analysing materials by determining their chemical or physical properties16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G02BOptical elements, systems or apparatus6%
G06FElectric digital data processing4%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
H01LSemiconductor devices2%
LOC242%
PatentTitleYear
D0928964Urea sensor202110,094,774Scattering measurement system and method20189,752,866'Measurement system'20179,182,681'Method and system for measuring a stacking overlay error by focusing on one of upper and lower layer overlay marks using a differential interference contrast microscope'20158,830,458'Measurement systems and measurement methods'20148,699,021'System, method and computer readable medium for through silicon via structure measurement'20148,537,213'Method for measuring via bottom profile'20138,386,969'Method for designing overlay targets and method and system for measuring overlay error using the same'20138,321,821'Method for designing two-dimensional array overlay targets and method and system for measuring overlay errors using the same'20128,319,971'Scatterfield microscopical measuring method and apparatus'20128,250,497'Method for designing two-dimensional array overlay target sets and method and system for measuring overlay errors using the same'20128,139,233'System and method for via structure measurement'20127,872,741'Method and apparatus for scatterfield microscopical measurement'20117,864,324'Reflective scatterometer'20117,847,939'Overlay measurement target'20107,800,824'Method for designing gratings'20107,652,776'Structure and method for overlay measurement'20107,619,753'Method for measuring dimensions and optical system using the same'20097,532,317'Scatterometry method with characteristic signatures matching'20097,477,396'Methods and systems for determining overlay error based on target image symmetry'20097,433,060'Method for correlating a structural parameter of a plurality of gratings and method for determining a structural parameter value of an unknown grating using the same'20087,430,052'Method for correlating the line width roughness of gratings and method for measurement'20087,379,184'Overlay measurement target'20087,355,713'Method for inspecting a grating biochip'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2018Patents assigned to IND TECH RES INST (21)· patent assignee history
2008–2010Patents assigned to ACCENT OPTICAL TECH INC (4)· patent assignee history
2008–2010Patents assigned to NANOMETRICS INC (4)· patent assignee history
2008–2018Based in Hsinchu, TW· patent location history
2012–2014Patents assigned to HSU WEI TE (5)· patent assignee history
2012–2014Patents assigned to KU YI SHA (5)· patent assignee history
2021Based in Dongguan, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 21 | 2008–2018 |
| HSU WEI TE | 5 | 2012–2014 |
| KU YI SHAself | 5 | 2012–2014 |
| ACCENT OPTICAL TECH INC | 4 | 2008–2010 |
| NANOMETRICS INC | 4 | 2008–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 23 | 2008–2018 |
| Dongguan, CN | 1 | 2021 |