Inventor
Koo Hong Lee
Inventor
Seoul, KR
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1073%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H01LSemiconductor devices4%
PatentTitleYear
9,768,102'Integrated circuit packaging system with support structure and method of manufacture thereof'20178,710,675'Integrated circuit package system with bonding lands'20148,481,371'Thin package system with external terminals and method of manufacture thereof'20138,471,374'Integrated circuit package system with L-shaped leadfingers'20138,432,026'Stackable multi-chip package system'20138,410,594'Inter-stacking module system'20138,125,076'Semiconductor package system with substrate heat sink'20128,067,272'Integrated circuit package system for package stacking and manufacturing method thereof'20118,026,582'Integrated circuit package system with internal stacking module adhesive'20118,012,867'Wafer level chip scale package system'20117,947,535'Thin package system with external terminals'20117,915,738'Stackable multi-chip package system with support structure'20117,915,724'Integrated circuit packaging system with base structure device'20117,736,950'Flip chip interconnection'20107,683,467'Integrated circuit package system employing structural support'20107,645,638'Stackable multi-chip package system with support structure'20107,622,333'Integrated circuit package system for package stacking and manufacturing method thereof'20097,521,297'Multichip package system'20096,661,083'Plastic semiconductor package'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Based in Yeonsu-gu, KR· patent location history
2009–2014Patents assigned to STATS CHIPPAC LTD (17)· patent assignee history
2009–2017Based in Seoul, KR· patent location history
2011–2017Patents assigned to LEE KOO HONG (8)· patent assignee history
2011–2014Patents assigned to KIM YOUNG CHEOL (3)· patent assignee history
2011–2013Patents assigned to YEE JAE HAK (3)· patent assignee history
2012–2013Patents assigned to KIM GWANG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 17 | 2009–2014 |
| LEE KOO HONGself | 8 | 2011–2017 |
| KIM YOUNG CHEOL | 3 | 2011–2014 |
| YEE JAE HAK | 3 | 2011–2013 |
| KIM GWANG | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 18 | 2009–2017 |
| Yeonsu-gu, KR | 1 | 2003 |