Inventor

His-Ying Yuan

Inventor

Taoyuan, TW

Overview

3→

Patents

2007–2009

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation29%

H05KPrinted circuits14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

PatentTitleYear

7,525,139'Image sensor with a protection layer'2009 7,400,037'Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP'2008 7,279,782'FBGA and COB package structure for image sensor'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2009Patents assigned to ADVANCED CHIP ENG TECH INC (2)· patent assignee history

2007–2009Based in Taoyuan, TW· patent location history

2008Patents assigned to ADVANCED CHIP ENGINEERING TACH (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ADVANCED CHIP ENG TECH INC	2	2007–2009
ADVANCED CHIP ENGINEERING TACH	1	2008

Locations

Location	Patents	Span
Taoyuan, TW	3	2007–2009