Inventor
Richard W. Arnold
Inventor
McKinney, TX, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G06FElectric digital data processing13%
Y10TTechnical subjects covered by former us classification11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
B28DWorking stone or stone-like materials3%
G02BOptical elements, systems or apparatus3%
H01RElectrically-conductive connections3%
H04QSelecting3%
PatentTitleYear
10,515,069Utilization of a concept to obtain data of specific interest to a user from one or more data storage locations201910,445,310Utilization of a concept to obtain data of specific interest to a user from one or more data storage locations20197,898,275'Known good die using existing process infrastructure'20117,181,457'System and method for utilizing compression in database caches to facilitate access to database information'20077,122,895'Stud-cone bump for probe tips used in known good die carriers'20067,026,833'Multiple-chip probe and universal tester contact assemblage'20066,996,584'System and method of maintaining functional client side data cache coherence'20066,988,165'System and method for intelligent write management of disk pages in cache checkpoint operations'20066,970,005'Multiple-chip probe and universal tester contact assemblage'20056,906,539'High density, area array probe card apparatus'20056,720,574'Method of testing a semiconductor chip'20046,720,780'High density probe card apparatus and method of manufacture'20046,636,063'Probe card with contact apparatus and method of manufacture'20036,553,661'Semiconductor test structure having a laser defined current carrying structure'20036,489,673'Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers'20026,376,352'Stud-cone bump for probe tips used in known good die carriers'20026,335,226'Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriers'20026,276,563'Verification and lockout apparatus for bulk feeder'20016,209,532'Soft handling process tooling for low and medium volume known good die product'20015,649,981'Tool and fixture for the removal of tab leads bonded to semiconductor die pads'19975,647,763'Multi-media cross connect system'19975,591,649'Process of removing a tape automated bonded semiconductor from bonded leads'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2011Patents assigned to TEXAS INSTRUMENTS INC (15)· patent assignee history
1997Patents assigned to SUPERIOR MODULAR PROD INC (1)· patent assignee history
1997Based in Midland, TX, US· patent location history
1997Based in Clermont, FL, US· patent location history
2001Patents assigned to MOTOROLA INC (1)· patent assignee history
2001–2011Based in McKinney, TX, US· patent location history
2001Based in Seguin, TX, US· patent location history
2006–2007Patents assigned to PERVASIVE SOFTWARE INC (3)· patent assignee history
2006–2019Based in Austin, TX, US· patent location history
2019Patents assigned to IBM (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 15 | 1997–2011 |
| PERVASIVE SOFTWARE INC | 3 | 2006–2007 |
| IBM | 2 | 2019 |
| MOTOROLA INC | 1 | 2001 |
| SUPERIOR MODULAR PROD INC | 1 | 1997 |
Locations
| Location | Patents | Span |
|---|---|---|
| McKinney, Texas, US | 13 | 2001–2011 |
| Austin, Texas, US | 5 | 2006–2019 |
| Midland, Texas, US | 2 | 1997 |
| Seguin, Texas, US | 1 | 2001 |
| Clermont, Florida, US | 1 | 1997 |