Inventor
CHUN-JEN CHEN
Inventor
TW
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10DInorganic electric semiconductor devices16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H04BTransmission3%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
B41MPrinting, duplicating, marking, or copying processes2%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%
C09BOrganic dyes or closely-related compounds for producing dyes, e.g. pigments2%
PatentTitleYear
12,596,302Crosstalk reduction of microcapsule imaging system202612,550,784Integrated circuit packages and methods of forming the same202612,482,763Semiconductor device package and methods of formation202512,450,599Payment management system using asymmetric cryptography to ensure information accuracy202512,444,647Electron migration control in interconnect structures202512,401,387Electronic module202512,394,735Shifting contact pad for reducing stress202512,354,907Electron migration control in interconnect structures202512,321,095Microcapsule imaging system including non-photopolymerizable reactive diluent202512,300,743Semiconductor device and method for fabricating the same202512,237,415Method for fabricating semiconductor device202512,176,297Semiconductor device package202412,051,634Package and package-on-package structure having elliptical columns and ellipsoid joint terminals202412,021,134Semiconductor device and method for fabricating the same202411,876,551Electronic module202411,769,833Method for fabricating semiconductor device202311,756,849Package and package-on-package structure having elliptical columns and ellipsoid joint terminals202311,587,835Semiconductor device and method for fabricating the same202311,545,560Semiconductor device and method for fabricating the same202311,495,686Semiconductor device and method for fabricating the same202211,488,891Method of forming conductive bumps for cooling device connection and semiconductor device202211,404,341Package and package-on-package structure having elliptical columns and ellipsoid joint terminals202211,302,646Semiconductor device package202211,264,273Electron migration control in interconnect structures202211,217,548Semiconductor device structure and manufacturing method202211,145,613Method for forming bump structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history
2021–2026Based in TW· patent location history
2022–2025Patents assigned to UNITED MICROELECTRONICS CORP (7)· patent assignee history
2022–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (4)· patent assignee history
2025–2026Patents assigned to POLAROID IP B V (2)· patent assignee history
2025Patents assigned to OWLTING USA INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 12 | 2021–2026 |
| UNITED MICROELECTRONICS CORP | 7 | 2022–2025 |
| ADVANCED SEMICONDUCTOR ENG | 4 | 2022–2025 |
| POLAROID IP B V | 2 | 2025–2026 |
| OWLTING USA INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 26 | 2021–2026 |