Inventor

WENTAO YAN

Inventor
CH

Overview

5→
Patents
2022–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

F16Bprimary
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges27%
B22FWorking metallic powder9%
B23KSoldering or unsoldering9%
B28BShaping clay or other ceramic compositions9%
B29CShaping or joining of plastics9%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering9%
H01JElectric discharge tubes or discharge lamps9%
LOC239%
Y02PClimate change mitigation technologies in the production or processing of goods9%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to UNIV TSINGHUA (1)· patent assignee history
2022–2024Based in CN· patent location history
2023Patents assigned to HILTI AG (3)· patent assignee history
2023Based in CH· patent location history
2024Patents assigned to HUAIAN HOHEAR TECH CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HILTI AG32023
HUAIAN HOHEAR TECH CO LTD12024
UNIV TSINGHUA12022
Locations
LocationPatentsSpan
CH32023
CN22022–2024