Inventor
Anton Pugatschow
Inventor
Soest, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
10,573,611Solder metallization stack and methods of formation thereof202010,283,432Molded package with chip carrier comprising brazed electrically conductive layers201910,115,688Solder metallization stack and methods of formation thereof201810,074,590Molded package with chip carrier comprising brazed electrically conductive layers2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2018–2020Based in Soest, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Soest, DE | 4 | 2018–2020 |