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Inventor

Jaw-Shiun Hsieh

Inventor
Kaohsiung, TW

Overview

2→
Patents
2001–2002
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
PatentTitleYear
6,429,049'Laser method for forming vias'20026,244,499'Structure of a ball bump for wire bonding and the formation thereof'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2002Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2001–2002Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG22001–2002
Locations
LocationPatentsSpan
Kaohsiung, TW22001–2002