Inventor
DAVID L. RATH
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10DInorganic electric semiconductor devices13%
H10NElectric solid-state devices not otherwise provided for13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B05DProcesses for applying fluent materials to surfaces, in general7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%
G06NComputing arrangements based on specific computational models7%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy7%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
12,048,254Sacrificial material facilitating protection of a substrate in a qubit device202411,857,997Metal surface protection202411,575,077Microfabricated air bridges for quantum circuits202311,316,154High throughput insulation of 3D in-silicon high volumetric energy and power dense energy storage devices202211,276,767Additive core subtractive liner for metal cut etch processes202211,152,489Additive core subtractive liner for metal cut etch processes2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (6)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2021–2024 |