Inventor
Kosuke Kawai
Inventor
Amagasaki, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering13%
B29CShaping or joining of plastics13%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form13%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds13%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
C08LCompositions of macromolecular compounds13%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties13%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to FUJI HEAVY IND LTD (1)· patent assignee history
2003Based in Shinjuku-ku, JP· patent location history
2020Patents assigned to SUBARU CORP (1)· patent assignee history
2020Based in Tokyo, JP· patent location history
2021Patents assigned to SHIRAISHI KOGYO KAISHA LTD (1)· patent assignee history
2021Based in Amagasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJI HEAVY IND LTD | 1 | 2003 |
| SHIRAISHI KOGYO KAISHA LTD | 1 | 2021 |
| SUBARU CORP | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Amagasaki, JP | 1 | 2021 |
| Tokyo, JP | 1 | 2020 |
| Shinjuku-ku, JP | 1 | 2003 |