LexDanaLexDanabeta
Inventor

Wei-Chung Wang

Inventor
Hsinchu, TW

Overview

105→
Patents
1987–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 105 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H01LSemiconductor devices10%
G06FElectric digital data processing9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10DInorganic electric semiconductor devices4%
G01BMeasuring length, thickness or similar linear dimensions3%
G06TImage data processing or generation, in general3%
H04NPictorial communication, e.g. television3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
G06KGraphical data reading3%
PatentTitleYear
11,128,382Multi-modulation-format compatible high-speed laser signal generation system and method202111,088,762Phase-lock-free system and method for receiving multi-modulation-format compatible high-speed laser signal202110,985,236Tunable on-chip nanosheet resistor202110,886,392Semiconductor structure for improving thermal stability and Schottky behavior202110,876,873Optical flow sensor, methods, remote controller device, and rotatable electronic device202010,637,458Series-connected SiC MOSFET drive circuit based on multi-winding transformer coupling202010,612,951Optical flow sensor, methods, remote controller device, and rotatable electronic device202010,598,786Object state determining apparatus and object state determining method202010,578,507Pressure measuring method and pressure measuring apparatus202010,545,528Control method applied to a joystick202010,529,758Packaging method and packaging structure202010,434,233Blood pump control system and blood pump system201910,431,114Oceaneering test platform device for simulating oceaneering working conditions201910,372,155Joystick and related control method201910,337,970Apparatus and method for in-situ testing impact strength of micro-structure201910,276,540Chip packaging method and chip packaging structure201910,181,536System and method for manufacturing photovoltaic structures with a metal seed layer201910,133,907Fingerprint recognition chip packaging structure and packaging method201810,126,151Wafer-level chip package structure and packaging method201810,108,837Fingerprint recognition chip packaging structure and packaging method201810,096,643Fingerprint recognition chip packaging structure and packaging method201810,090,217Chip packaging method and package structure201810,075,237Visible light communication system and method201810,067,012Stress measurement method and system for optical materials201810,036,677Method for analyzing stress in an object201810,006,761Method and system for on-line real-time measuring the surface topography and out-of plane deformation by using phase-shifting shadow moire method20189,952,034Optical interferometric system for measurement of a full-field thickness of a plate-like object in real time20189,883,115'Method of determining whole-scene image by using multiple image-capturing devices'2018D0806669'Handset'20189,762,897'Conic section calibration object for calibrating image capturing device'20179,761,744'System and method for manufacturing photovoltaic structures with a metal seed layer'20179,748,162'Chip to wafer package with top electrodes and method of forming'20179,644,947'Optical interferometric apparatus for real-time full-field thickness inspection and method thereof'20179,601,531'Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions'20179,568,302'Concentric circle adjusting apparatus for multiple image capturing device'2017D0773426'Handset'20169,465,162'Packaging an arcuate planar lightwave circuit'20169,455,298'Wafer-level packaging method of BSI image sensors having different cutting processes'20169,430,478'Anchor image identification for vertical video search'20169,398,286'Multi-image capture device capturing images by means of circular motion'20169,395,173'Multi-functioned optical measurement device and method for optically measuring a plurality of parameters'20169,305,961'Wafer-level packaging method of BSI image sensors having different cutting processes'20169,299,735'Image sensor package structure and method'20169,279,823'Optical accelerometer'20169,246,347'Battery charging circuit with serial connection of MOSFET and an enhancement mode JFET configured as reverse blocking diode with low forward voltage drop'20169,231,018'Wafer level packaging structure for image sensors and wafer level packaging method for image sensors'20169,213,138'Packaging an arcuate planar lightwave circuit'20159,202,942'Connector of connecting light sensor and substrate and method of fabricating light sensor'20159,116,854'Method of evaluating image correlation with speckle patter'20159,117,871'Multi-axial acceleration sensor and method of manufacturing the same'20159,036,157'System of computing surface reconstruction, in-plane and out-of-plane displacements and strain distribution'20158,952,512'Wafer-level package structure of light emitting diode and manufacturing method thereof'20158,913,034'Connector of connecting light sensor and substrate and method of fabricating light sensor'20148,841,593'Sensing device and image sensor module thereof'20148,803,943'Formation apparatus using digital image correlation'20148,780,348'Apparatus for quantifying unknown stress and residual stress of a material and method thereof'20148,669,613'Semiconductor device die with integrated MOSFET and low forward voltage diode-connected enhancement mode JFET and method'20148,645,354'Scalable metadata extraction for video search'20148,645,353'Anchor image identification for vertical video search'20148,605,264'Apparatus and method for quantifying residual stress of a birefringent material'20138,594,780'Method for analyzing the structure of an electrically conductive object'20138,538,187'Defocus calibration module for light-sensing system and method thereof'20138,531,593'Display panel with image capture module and assembling method of the same'20138,513,041'MEMS integrated chip and method for making same'20138,508,509'Optical touch display device'20138,478,074'Providing multiple and native representations of an image'20138,473,574'Automatic online video discovery and indexing'20138,445,919'Wafer-level package structure of light emitting diode and manufacturing method thereof'20138,421,173'Chip package structure and chip packaging process'20138,330,094'Optical sensing module and optical mouse with the same'20128,288,853'Three-dimensional package and method of making the same'20128,258,842'Dead-time detecting circuit for inductive load and modulation circuit using the same'20128,207,785'Charge pump circuit with improved reliability'20128,174,090'Packaging structure'20128,158,888'Circuit substrate and method of fabricating the same and chip package structure'20128,110,928'Stacked-type chip package structure and method of fabricating the same'20128,110,837'Sensing module'20128,094,449'Fastening structure of computer peripheral device'20127,946,857'Circuit interface device'20117,945,062'Microelectromechanical microphone packaging system'20117,811,858'Package and the method for making the same, and a stacked package'20107,795,074'WLCSP target and method for forming the same'20107,781,250'Wafer level chip size package for MEMS devices and method for fabricating the same'20107,755,155'Packaging structure and method for fabricating the same'20107,741,152'Three-dimensional package and method of making the same'20107,706,149'Micro-electro-mechanical-system package and method for manufacturing the same'20107,663,213'Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same'20107,642,132'Three-dimensional package and method of making the same'20107,528,053'Three-dimensional package and method of making the same'20097,501,342'Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same'20097,491,568'Wafer level package and method for making the same'20097,446,404'Three-dimensional package and method of making the same'20087,410,886'Method for fabricating protective caps for protecting elements on a wafer surface'20087,394,152'Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same'20087,385,175'Bi-directional optical transmission system and method'20087,353,165'Example based machine translation system'20087,336,259'Rechargeable wireless input device'20087,287,863'Light tunnel with gradient filter layer'20077,181,480'System and method for managing internet storage'20076,884,422'Freeze-dried hepatitis A attenuated live vaccine and its stabilizer'20056,856,507'Personal digital assistant assembly'20056,383,846'Method and apparatus for molding a flip chip semiconductor device'20026,342,443'Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate'20026,153,939'Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same'20004,716,510'Automatic restart circuit for a switching power supply'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2012Patents assigned to ADVANCED SEMICONDUCTOR ENG (15)· patent assignee history
2000–2018Based in Kaohsiung, TW· patent location history
2005–2018Based in Taipei, TW· patent location history
2008–2016Patents assigned to WANG WEI (11)· patent assignee history
2008–2020Based in Suzhou, CN· patent location history
2008–2019Based in Beijing, CN· patent location history
2012–2020Patents assigned to PIXART IMAGING INC (17)· patent assignee history
2012–2014Patents assigned to WANG WEI-CHUNG (12)· patent assignee history
2012–2020Based in Hsinchu, TW· patent location history
2016–2020Patents assigned to CHINA WAFER LEVEL CSP CO LTD (13)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PIXART IMAGING INC172012–2020
ADVANCED SEMICONDUCTOR ENG152000–2012
CHINA WAFER LEVEL CSP CO LTD132016–2020
WANG WEI-CHUNGself122012–2014
WANG WEIself112008–2016
Locations
LocationPatentsSpan
Hsinchu, TW282012–2020
Suzhou, CN162008–2020
Kaohsiung, TW162000–2018
Taipei, TW112005–2018
Beijing, CN92008–2019