Inventor

DAVID WOLPERT

Inventor
US

Overview

22→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing23%
H01LSemiconductor devices19%
H10DInorganic electric semiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G01RMeasuring electric variables4%
H10BElectronic memory devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B82YSpecific uses or applications of nanostructures2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
G05DSystems for controlling or regulating non-electric variables2%
PatentTitleYear
12,575,402Non-planar metal-insulator-metal structure202612,500,144Backside self aligned skip via202512,412,020Effective metal density screens for hierarchical design rule checking (DRC) analysis202512,381,149Cell optimization through source resistance improvement202512,382,621Decoupling capacitor inside gate cut trench202512,362,278Transistors with dual power and signal lines202512,271,674Generating a power delivery network based on the routing of signal wires within a circuit design202512,266,393Negative capacitance for ferroelectric capacitive memory cell202512,176,289Semiconductor device design mitigating latch-up202412,112,114Hierarchical color decomposition of library cells with boundary-aware color selection202412,057,387Decoupling capacitor inside gate cut trench202411,941,340Cross-hierarchy antenna condition verification202411,916,099Multilayer dielectric for metal-insulator-metal capacitor202411,916,384Region-based power grid generation through modification of an initial power grid based on timing analysis202411,906,570Processor frequency improvement based on antenna optimization202411,830,778Back-side wafer modification202311,822,867Hierarchical color decomposition of process layers with shape and orientation requirements202311,754,615Processor frequency improvement based on antenna optimization202311,663,391Latch-up avoidance for sea-of-gates202311,586,798Avoiding electrostatic discharge events from cross-hierarchy tie nets202311,487,308Ensuring IoT device functionality in the presence of multiple temperature dependencies202211,308,257Stacked via rivets in chip hotspots2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to IBM (22)· patent assignee history
2022–2026Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM222022–2026
Locations
LocationPatentsSpan
US222022–2026