Inventor
I-Chih Chen
Inventor
Tainan, TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10DInorganic electric semiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
G06FElectric digital data processing3%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them2%
H04NPictorial communication, e.g. television2%
PatentTitleYear
11,061,313Wavelength conversion module, method of forming wavelength conversion module, illumination system and projection apparatus202110,804,378Method for semiconductor device fabrication with improved epitaxial source/drain proximity control202010,680,103Method of forming semiconductor device with gate202010,608,094Semiconductor device and method of forming the same202010,516,048Fabrication of semiconductor device201910,361,287Method for manufacturing semiconductor device structure201910,153,278Fin-type field effect transistor structure and manufacturing method thereof201810,096,672Semiconductor device having barrier layer to prevent impurity diffusion201810,090,392Semiconductor device and manufacturing method thereof201810,056,455Semiconductor device and method of fabricating the same20189,865,731'Semiconductor device and manufacturing method thereof'20189,812,569'Semiconductor device and fabricating method thereof'20179,768,221'Pad structure layout for semiconductor device'20179,728,598'Semiconductor device having barrier layer to prevent impurity diffusion'20179,728,637'Mechanism for forming semiconductor device with gate'20179,659,859'Metal pad offset for multi-layer metal layout'20179,490,345'Semiconductor device and manufacturing method thereof'20169,450,093'Semiconductor device structure and manufacturing method thereof'20169,281,215'Mechanism for forming gate'20169,252,180'Bonding pad on a back side illuminated image sensor'20169,093,430'Metal pad offset for multi-layer metal layout'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2015–2020Based in Tainan, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history
2017Based in Taipei, TW· patent location history
2021Patents assigned to CORETRONIC CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 18 | 2016–2020 |
| TAIWAN SEMICONDUCTOR MFG | 2 | 2015–2016 |
| CORETRONIC CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 19 | 2015–2020 |
| Taipei, TW | 1 | 2017 |