Inventor
SEONG-HOON BAE
Inventor
KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H05KPrinted circuits6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,575,437Redistribution substrate, semiconductor package including the same, and method of fabricating redistribution substrate202612,381,151Semiconductor device and semiconductor package including the same202512,381,130Semiconductor package202512,183,664Semiconductor package202412,107,063Semiconductor package device202411,742,271Semiconductor package202311,664,312Semiconductor device and semiconductor package including the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2023–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 7 | 2023–2026 |