Inventor
Chia-Jen Chou
Inventor
Hsinchu County, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
G01MTesting static or dynamic balance of machines or structures8%
PatentTitleYear
10,249,573Semiconductor device package with a stress relax pattern201910,126,210Fault detection and classification matching20189,899,287'Fan-out wafer level package structure'20189,842,811'Heat-dissipating semiconductor package for lessening package warpage'20179,831,219Manufacturing method of package structure2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2019Patents assigned to POWERTECH TECHNOLOGY INC (4)· patent assignee history
2017–2019Based in Hsinchu County, TW· patent location history
2018Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2018Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| POWERTECH TECHNOLOGY INC | 4 | 2017–2019 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 4 | 2017–2019 |
| Taipei, TW | 1 | 2018 |