Inventor
Yeon Ho Choi
Inventor
Chandler, AZ, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
F16DCouplings for transmitting rotation13%
G09GArrangements or circuits for control of indicating devices using static means to present variable information13%
C04BLime, magnesia9%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein9%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
H01GCapacitors4%
PatentTitleYear
10,748,712Multilayer ceramic electronic component202010,174,801Method for manufacturing vehicle brake disc201910,072,719Brake disk having double cooling structure20189,732,811'Carbon ceramic brake disc and method for manufacturing the same'20179,495,934'Liquid crystal display device and method for driving the same'20168,711,068'Liquid crystal display device and driving method thereof'20148,441,110'Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package'20138,432,023'Increased I/O leadframe and semiconductor device including same'20138,299,602'Semiconductor device including leadframe with increased I/O'20128,188,579'Semiconductor device including leadframe having power bars and increased I/O'20127,989,933'Increased I/O leadframe and semiconductor device including same'20117,968,998'Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package'20117,875,963'Semiconductor device including leadframe having power bars and increased I/O'20117,847,392'Semiconductor device including leadframe with increased I/O'20107,791,579'Automatic reset circuit'20106,437,427'Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same'20026,339,252'Electronic device package and leadframe'20026,258,629'Electronic device package and leadframe and method for making the package'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2013Patents assigned to AMKOR TECHNOLOGY INC (11)· patent assignee history
2001–2002Patents assigned to ANAM SEMICONDUCTOR INC (2)· patent assignee history
2001–2002Based in Seoul, KR· patent location history
2010–2016Patents assigned to LG DISPLAY CO LTD (3)· patent assignee history
2010–2013Based in Chandler, AZ, US· patent location history
2010–2014Based in Gyeonggi-do, KR· patent location history
2012–2016Patents assigned to CHOI YEON HO (6)· patent assignee history
2017–2019Patents assigned to DACC CARBON CO LTD (2)· patent assignee history
2017–2019Based in Jeonju-si, KR· patent location history
2020Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 11 | 2001–2013 |
| CHOI YEON HOself | 6 | 2012–2016 |
| LG DISPLAY CO LTD | 3 | 2010–2016 |
| ANAM SEMICONDUCTOR INC | 2 | 2001–2002 |
| DACC CARBON CO LTD | 2 | 2017–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 8 | 2010–2013 |
| Jeonju-si, KR | 3 | 2017–2019 |
| Seoul, KR | 3 | 2001–2002 |
| Gyeonggi-do, KR | 2 | 2010–2014 |
| Suwon-si, KR | 1 | 2020 |