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Inventor

Motojiro Shibata

Inventor
Yokohama, JP

Overview

2→
Patents
2001–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
8,142,611'Semiconductor-chip exfoliating device and semiconductor-device manufacturing method'20126,193,132'Method for bonding semiconductor chip and device therefor'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2012Patents assigned to TOSHIBA KK (2)· patent assignee history
2001–2012Based in Yokohama, JP· patent location history
2012Patents assigned to SHIBATA MOTOJIRO (1)· patent assignee history
2012Patents assigned to USHIJIMA AKIRA (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK22001–2012
SHIBATA MOTOJIROself12012
USHIJIMA AKIRA12012
Locations
LocationPatentsSpan
Yokohama, JP22001–2012