Inventor
Walter M. Whybrew
Inventor
Palm Bay, FL, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Qprimary
H01QAntennas, i.e. radio aerials33%
H05KPrinted circuits27%
H01PWaveguides21%
Y10TTechnical subjects covered by former us classification12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
7,948,766'Method of making printed wiring board with enhanced structural integrity'20117,907,417'Printed circuit board (PCB)with enhanced structural integrity'20117,499,287'Printed wiring board with enhanced structural integrity'20097,479,604'Flexible appliance and related method for orthogonal, non-planar interconnections'20097,342,801'Printed wiring board with enhanced structural integrity'20086,937,120'Conductor-within-a-via microwave launch'20056,894,582'Microwave device having a slotted coaxial cable-to-microstrip connection and related methods'20056,473,039'Sloppy coax interconnect for low cost RF and phased array applications'20026,429,816'Spatially orthogonal signal distribution and support architecture for multi-beam phased array antenna'20026,320,546'Phased array antenna with interconnect member for electrically connnecting orthogonally positioned elements used at millimeter wavelength frequencies'20016,266,015'Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit'20016,166,705'Multi title-configured phased array antenna architecture'20006,130,585'Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks'20006,097,260'Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks'20006,028,494'High isolation cross-over for canceling mutually coupled signals between adjacent stripline signal distribution networks'20005,907,304'Lightweight antenna subpanel having RF amplifier modules embedded in honeycomb support structure between radiation and signal distribution networks'19995,894,983'High frequency, low temperature thermosonic ribbon bonding process for system-level applications'19995,384,555'Combined RF and digital/DC signalling interconnect laminate'19954,956,621'Three-state, two-output variable RF power divider'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2011Patents assigned to HARRIS CORP (18)· patent assignee history
1990–2011Based in Palm Bay, FL, US· patent location history
2009Based in Grant, FL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HARRIS CORP | 18 | 1990–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palm Bay, Florida, US | 18 | 1990–2011 |
| Grant, Florida, US | 1 | 2009 |