Inventor
XAVIER FRANCOIS BRUN
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,581,988Microelectronic assemblies with through die attach film connections202612,557,675Inorganic redistribution layer on organic substrate in integrated circuit packages202612,538,841Quasi-monolithic die architectures202612,412,868Microelectronic assemblies including interconnects with different solder materials202512,368,089Low cost embedded integrated circuit dies202512,347,782Microelectronic assemblies with direct attach to circuit boards202512,176,292Microelectronic component having molded regions with through-mold vias202411,817,390Microelectronic component having molded regions with through-mold vias202311,640,942Microelectronic component having molded regions with through-mold vias202311,302,643Microelectronic component having molded regions with through-mold vias2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (10)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2026 |