Inventor
Masao Kawasumi
Inventor
Hitachi, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds33%
H01BCables33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
C08LCompositions of macromolecular compounds11%
PatentTitleYear
6,774,501'Resin-sealed semiconductor device, and die bonding material and sealing material for use therein'20045,350,811'Epoxy resin and adhesive composition containing the same'19945,258,139'Epoxy resin and adhesive composition containing the same'19935,188,767'Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2004Patents assigned to HITACHI CHEMICAL CO LTD (4)· patent assignee history
1993–2004Based in Hitachi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 4 | 1993–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 4 | 1993–2004 |