Inventor
Brian R. Kemper
Inventor
Mount Prospect, IL, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Kprimary
G06KGraphical data reading27%
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H02HEmergency protective circuit arrangements9%
Y02PClimate change mitigation technologies in the production or processing of goods9%
PatentTitleYear
6,200,829'Microelectronic assembly with connection to a buried electrical element, and method for forming same'20015,898,215'Microelectronic assembly with connection to a buried electrical element, and method for forming same'19995,856,912'Microelectronic assembly for connection to an embedded electrical element, and method for forming same'19994,969,062'Ground fault protection circuit'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2001Patents assigned to MOTOROLA INC (4)· patent assignee history
1990Based in Chicago, IL, US· patent location history
1999–2001Based in Mount Prospect, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 4 | 1990–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mount Prospect, Illinois, US | 3 | 1999–2001 |
| Chicago, Illinois, US | 1 | 1990 |