Inventor
Chih-Hang Tung
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01RElectrically-conductive connections23%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
11,121,104Method for manufacturing interconnect structure202111,107,747Semiconductor package with composite thermal interface material structure and method of forming the same202111,101,195Package structure and method for forming the same202111,056,459Chip package structure and method for forming the same202110,483,676Electrical connector with a latch structure201910,424,866Waterproof connector201910,181,687Connector module2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019Patents assigned to F TIME TECH INDUSTRIAL CO LTD (3)· patent assignee history
2019Based in New Taipei, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2021 |
| F TIME TECH INDUSTRIAL CO LTD | 3 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 4 | 2021 |
| New Taipei, TW | 3 | 2019 |