Inventor
MARIO BOKATIUS
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H03FAmplifiers21%
H10DInorganic electric semiconductor devices21%
PatentTitleYear
12,113,490Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias202412,074,149Device packages with uniform components and methods of forming the same202411,863,130Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias202411,837,559Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2024Patents assigned to WOLFSPEED INC (2)· patent assignee history
2023Patents assigned to CREE INC (1)· patent assignee history
2023–2024Based in US· patent location history
2024Patents assigned to MACOM TECH SOLUTIONS HOLDINGS INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MACOM TECH SOLUTIONS HOLDINGS INC | 2 | 2024 |
| WOLFSPEED INC | 2 | 2023–2024 |
| CREE INC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2024 |