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Inventor

Hiroaki Matsui

Inventor
Numazu, JP

Overview

36→
Patents
1999–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 36 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Mprimary
B41MPrinting, duplicating, marking, or copying processes19%
H04BTransmission11%
H04LTransmission of digital information, e.g. telegraphic communication7%
H03DDemodulation or transference of modulation from one carrier to another6%
H03CModulation5%
H03GControl of amplification5%
Y10TTechnical subjects covered by former us classification5%
G02BOptical elements, systems or apparatus4%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H03FAmplifiers4%
PatentTitleYear
11,046,043Linerless thermosensitive recording body package202110,871,676Illumination unit and display apparatus20209,214,980'High-frequency signal processor and wireless communication system'20159,001,871'High-frequency signal processor and wireless communication system'20158,915,606'Display device'20148,374,559'Transmitter, RF transmitter signal processor and method for operation of transmitter'20138,315,579'Semiconductor integrated circuit for communication'20128,150,342'Transmitter, RF transmitter signal processor and method for operation of transmitter'20128,096,064'Method for drying lumber, method of impregnating lumber with chemicals, and drying apparatus'20128,095,094'Communication semiconductor integrated circuit, communication electronic component and wireless communication system'20128,008,229'Thermosensitive recording material'20117,989,529'Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material'20117,848,716'Semiconductor integrated circuit for communication'20107,567,382'Optical filter'20097,515,648'Transmitter and wireless communication apparatus using same'20097,463,876'Communication semiconductor integrated circuit, communication electronic component and wireless communication system'20087,384,148'Projection type image display apparatus and optical system'20087,333,565'Semiconductor integrated circuit for communication'20087,239,855'communication semiconductor integrated circuit device and wireless communication system'20077,213,920'Image display apparatus'20077,116,950'Direct-conversion transmitting circuit and integrated transmitting/receiving circuit'20066,677,273'Erasable recording material capable of inputting additional information written thereon and information recording system and information recording method using the recording material'20046,673,311'Method and apparatus for continuous heat sterilization of liquid'20046,573,450'Waterproof structure for terminal portion of electric wire provided on housing body for electric components'20036,524,377'Reversible thermosensitive coloring composition and recording material using the composition and recording method using the recording material'20036,503,868'Reversible thermosensitive coloring composition and recording material using the composition and recording method using the recording material'20036,432,518'Erasable recording material capable of inputting additional information written thereon and information recording system and information recording method using the recording material'20026,410,478'Reversible thermosensitive recording medium'20026,261,992'Reversible thermosensitive recording material and recording method and apparatus therefor'20016,207,613'Reversible thermosensitive coloring composition and recording material using the composition and recording method using the recording material'20016,154,243'Reversible thermal recording method and apparatus therefor'20006,090,748'Reversible thermosensitive recording material and recording method and recording apparatus therefor'20006,090,192'Reversible thermosensitive coloring composition and reversible thermosensitive recording medium using same'20005,942,377'Reversible thermosensitive composition and reversible thermosensitive recording medium using same'19995,891,823'Reversible thermosensitive recording medium'19995,868,821'Thermally reversible color forming composition and thermally reversible recording medium using the thermally reversible color forming composition'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2004Patents assigned to RICOH KK (13)· patent assignee history
1999–2011Based in Numazu, JP· patent location history
2002–2021Based in Shizuoka, JP· patent location history
2006–2012Based in Takasaki, JP· patent location history
2007–2020Patents assigned to SONY CORP (4)· patent assignee history
2007–2009Patents assigned to RENESAS TECH CORP (3)· patent assignee history
2007–2020Based in Tokyo, JP· patent location history
2010–2015Patents assigned to RENESAS ELECTRONICS CORP (7)· patent assignee history
2012–2021Patents assigned to MATSUI HIROAKI (6)· patent assignee history
2015Based in Kawasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RICOH KK131999–2004
RENESAS ELECTRONICS CORP72010–2015
MATSUI HIROAKIself62012–2021
SONY CORP42007–2020
RENESAS TECH CORP32007–2009
Locations
LocationPatentsSpan
Numazu, JP131999–2011
Takasaki, JP82006–2012
Tokyo, JP52007–2020
Shizuoka, JP32002–2021
Kawasaki, JP22015