Inventor
Hon-Hung Lui
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10BElectronic memory devices11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
PatentTitleYear
6,153,517'Low resistance poly landing pad'20006,071,812'Method of forming a modified metal contact opening to decrease its aspect ratio for deep sub-micron processes'20005,956,569'Integrated thermoelectric cooler formed on the backside of a substrate'19995,956,566'Method and test site to monitor alignment shift and buried contact trench formation'19995,879,991'Trench free polysilicon gate definition process for a non-volatile memory device'19995,869,370'Ultra thin tunneling oxide using buffer CVD to improve edge thinning'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2000Patents assigned to TAIWAN SEMICONDUCTOR MFG (6)· patent assignee history
1999–2000Based in Hsinchu, TW· patent location history
1999Based in Hsichu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 6 | 1999–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 1999–2000 |
| Hsichu, TW | 1 | 1999 |