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Inventor

Hui Wang

Inventor
Taipei, TW

Overview

20→
Patents
2005–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices11%
H10BElectronic memory devices7%
H10NElectric solid-state devices not otherwise provided for7%
G11CStatic stores6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks6%
H10DInorganic electric semiconductor devices6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
LOC076%
H02JElectric power networks4%
PatentTitleYear
D0930423Pressure cooker2021D0927919Pressure cooker2021D0925268Electric induction cooker202110,873,323Systems and methods for calibrating impedance of a low power voltage-mode transmitter driver202010,855,254Systems and methods for calibrating impedance of a low power voltage-mode transmitter driver202010,847,574Semiconductor memory device and fabrication method thereof202010,840,432Semiconductor device and method for fabricating the same202010,727,397Magnetoresistive random access memory cell202010,707,412Semiconductor device and manufacturing method thereof202010,476,261Method and system for fault positioning and recovery of voltage source converter201910,396,562Series compensation device applicable to double-circuit line201910,290,710Semiconductor device and method for forming the same201910,015,591Pickup apparatus and pickup method20189,918,227'Network connectivity switching utilizing an authentication device'20189,892,131'Method, electronic device, and storage medium for creating virtual directory'20189,674,704'Network connectivity switching utilizing an authentication device'20179,198,217'Method for maintaining connection between terminal and network server, terminal and network server'20159,190,351'Semiconductor device with webbing between leads'20158,207,037'Method for manufacturing a semiconductor component that includes a field plate'20126,897,561'Semiconductor power device having a diamond shaped metal interconnect scheme'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to MOTOROLA MOBILITY LLC (2)· patent assignee history
2017–2018Based in Buffalo Grove, IL, US· patent location history
2019–2020Patents assigned to UNITED MICROELECTRONICS CORP (5)· patent assignee history
2019Patents assigned to NR ELECTRIC CO LTD (2)· patent assignee history
2019–2020Based in Taipei, TW· patent location history
2019Based in Jiangsu, CN· patent location history
2020Patents assigned to MARVELL ASIA PTE LTD (2)· patent assignee history
2020Based in Pleasanton, CA, US· patent location history
2021Patents assigned to MIDEA GROUP CO LTD (3)· patent assignee history
2021Based in Guangdong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP52019–2020
MIDEA GROUP CO LTD32021
MARVELL ASIA PTE LTD22020
MOTOROLA MOBILITY LLC22017–2018
NR ELECTRIC CO LTD22019
Locations
LocationPatentsSpan
Taipei, TW52019–2020
Guangdong, CN32021
Pleasanton, California, US22020
Jiangsu, CN22019
Buffalo Grove, Illinois, US22017–2018