Inventor
CHUNG-HSIEN LIU
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices21%
H10BElectronic memory devices14%
G11CStatic stores7%
PatentTitleYear
12,527,037Semiconductor device with floating gate, and method for manufacturing the same202612,402,361Semiconductor structure and method for forming the same202512,176,440Semiconductor structure with an air gap and method of forming the same202412,119,261Semiconductor structure and manufacturing method of the same2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to WINBOND ELECTRONICS CORP (4)· patent assignee history
2024–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 4 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 4 | 2024–2026 |