Inventor
David C. Long
Inventor
Wappingers Falls, NY, US
Overview
Patents· 154 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10TTechnical subjects covered by former us classification10%
G06FElectric digital data processing7%
B26FPerforating4%
B23KSoldering or unsoldering3%
B26DCutting3%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
11,122,682Tamper-respondent sensors with liquid crystal polymer layers202111,083,082Enclosure-to-board interface with tamper-detect circuit(s)202110,798,816Tamper detection at enclosure-to-board interface202010,739,751Apparatus for facilitating evaluating rechargeable batteries202010,685,146Overlapping, discrete tamper-respondent sensors202010,624,202Tamper-respondent assemblies with bond protection202010,595,401Tamper detection at enclosure-to-board interface202010,595,4193-D flex circuit forming202010,575,398Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout202010,568,202Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout202010,531,561Enclosure-to-board interface with tamper-detect circuit(s)202010,395,067Method of fabricating a tamper-respondent sensor assembly201910,378,925Circuit boards and electronic packages with embedded tamper-respondent sensor201910,378,924Circuit boards and electronic packages with embedded tamper-respondent sensor201910,334,722Tamper-respondent assemblies201910,331,915Overlapping, discrete tamper-respondent sensors201910,327,329Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor201910,327,343Applying pressure to adhesive using CTE mismatch between components201910,306,753Enclosure-to-board interface with tamper-detect circuit(s)201910,271,434Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage201910,264,665Tamper-respondent assemblies with bond protection201910,257,939Method of fabricating tamper-respondent sensor201910,257,924Tamper-proof electronic packages formed with stressed glass201910,251,288Tamper-respondent assembly with vent structure201910,242,931Liquid cooled compliant heat sink and related method201910,175,064Circuit boards and electronic packages with embedded tamper-respondent sensor201910,178,818Enclosure with inner tamper-respondent sensor(s) and physical security element(s)201910,177,075Liquid cooled compliant heat sink and related method201910,168,185Circuit boards and electronic packages with embedded tamper-respondent sensor201910,172,232Tamper-respondent assemblies with enclosure-to-board protection201910,172,239Tamper-respondent sensors with formed flexible layer(s)201910,098,235Tamper-respondent assemblies with region(s) of increased susceptibility to damage20189,999,124Tamper-respondent assemblies with trace regions of increased susceptibility to breaking20189,936,573Tamper-respondent assemblies20189,924,591'Tamper-respondent assemblies'20189,913,416'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'20189,913,370'Tamper-proof electronic packages formed with stressed glass'20189,911,012'Overlapping, discrete tamper-respondent sensors'20189,913,362'Tamper-respondent assemblies with bond protection'20189,913,389'Tamper-respondent assembly with vent structure'20189,894,749'Tamper-respondent assemblies with bond protection'20189,877,383Tamper-respondent assemblies with enclosure-to-board protection20189,717,154'Enclosure with inner tamper-respondent sensor(s)'20179,661,747'Tamper-respondent assemblies with enclosure-to-board protection'20179,591,776'Enclosure with inner tamper-respondent sensor(s)'20179,578,764'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'20179,555,606'Applying pressure to adhesive using CTE mismatch between components'20179,554,477'Tamper-respondent assemblies with enclosure-to-board protection'20178,390,729'Method and apparatus for providing a video image having multiple focal lengths'20138,297,222'Fully automated paste dispense system for dispensing small dots and lines'20128,106,331'Apparatus for controlling alignment between precision ground plates and method of controlling a desired alignment between opposing precision ground plates'20128,090,504'Feedback loop system for passenger safety'20128,020,599'Common carrier'20117,964,237'Fully automated paste dispense process for dispensing small dots and lines'20117,894,919'Fully automated paste dispense system for dispensing small dots and lines'20117,887,874'Fully automated paste dispense system for dispensing small dots and lines'20117,880,739'Virtual window with simulated parallax and field of view change'20117,879,171'Common carrier'20117,819,027'Method and structure for a pull test for controlled collapse chip connections and ball limiting metallurgy'20107,806,341'Structure for implementing secure multichip modules for encryption applications'20107,724,527'Method and structure to improve thermal dissipation from semiconductor devices'20107,709,951'Thermal pillow'20107,687,894'IC chip package having automated tolerance compensation'20107,515,178'Method of correcting distortions in digital images captured by a digital camera system'20097,472,836'Method and structure for implementing secure multichip modules for encryption applications'20097,468,886'Method and structure to improve thermal dissipation from semiconductor devices'20087,436,057'Elastomer interposer with voids in a compressive loading system'20087,394,666'Circuit board cam-action standoff connector'20087,391,442'Digital camera including a distortion correction system'20087,350,423'Real time usage monitor and method for detecting entrapped air'20087,294,909'Electronic package repair process'20077,281,667'Method and structure for implementing secure multichip modules for encryption applications'20077,278,459'Common carrier'20077,239,516'Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip'20077,118,385'Apparatus for implementing a self-centering land grid array socket'20067,107,901'Method and apparatus for rapid cooling of metal screening masks'20067,086,896'Expandable standoff connector with slit collar and related method'20067,045,011'Dual-layer compliant polymeric nozzle'20066,988,310'Method of assembling an interconnect device assembly'20066,975,199'Embedded inductor and method of making'20056,931,712'Method of forming a dielectric substrate having a multiturn inductor'20056,917,194'External verification of package processed linewidths and spacings in semiconductor packages'20056,916,670'Electronic package repair process'20056,823,585'Method of selective plating on a substrate'20046,806,793'MLC frequency selective circuit structures'20046,679,146'Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool'20046,573,728'Method and circuit for electrical testing of isolation resistance of large capacitance network'20036,569,278'Powder metal polymer organic sheet punching for substrate conductors'20036,565,496'Fully automated precision punch head loader for universal gang-punch tool'20036,532,654'Method of forming an electrical connector'20036,528,735'Substrate design of a chip using a generic substrate design'20036,521,355'Optical color tracer indentifier in metal paste that bleed to greensheet'20036,475,555'Process for screening features on an electronic substrate with a low viscosity paste'20026,405,622'Support apparatus for positioning a workpiece'20026,402,866'Powdered metallic sheet method for deposition of substrate conductors'20026,389,940'Gang punch tool assembly'20026,352,014'Method for making punches using multi-layer ceramic technology'20026,341,417'Pre-patterned substrate layers for being personalized as needed'20026,314,852'Gang punch tool assembly'20016,291,272'Structure and process for making substrate packages for high frequency application'20016,276,246'Method for punching slug from workpiece'20016,278,049'Thermoelectric devices and methods for making the same'20016,272,957'Flex die punching apparatus and method'20016,262,357'Thermoelectric devices and methods for making the same'20016,262,390'Repair process for aluminum nitride substrates'20016,231,707'Method of forming a multilayer ceramic substrate with max-punched vias'20016,223,636'Low-cost high-density gang punch'20016,207,330'Formation of punch inspection masks and other devices using a laser'20016,194,085'Optical color tracer identifier in metal paste that bleed to greensheet'20016,133,540'Apparatus and method for producing punch pin with spherical head'20006,127,069'Method of visually inspecting positioning of a pattern on a substrate'20006,121,539'Thermoelectric devices and methods for making the same'20006,116,127'Flex die punching apparatus and method'20006,055,894'Support apparatus for positioning a workpiece'20006,038,931'Method and apparatus for the testing of plastically deformable objects'20006,032,683'System for cleaning residual paste from a mask'20006,017,025'Component retainer'20006,003,418'Punched slug removal system'19995,996,985'Component retainer'19995,974,931'Flex die punching apparatus and method'19995,958,628'Formation of punch inspection masks and other devices using a laser'19995,927,193'Process for via fill'19995,929,865'Method of sorting two-dimensional graphic images for converting into raster lines'19995,916,374'Optimized in-line mask cleaning system'19995,905,352'Magneto-repulsion punching with dynamic damping'19995,891,543'Apparatus and method for screening using electrostatic adhesion'19995,846,361'Lamination process for producing non-planar substrates'19985,808,268'Method for marking substrates'19985,795,217'Stressed burnisher'19985,759,669'Apparatus and method for screening green sheet with via hole using porous backing material'19985,757,842'Method and apparatus for compensating thermal lensing effects in a laser cavity'19985,751,588'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection'19985,745,238'Apparatus and method for non-destructive inspection and/or measurement'19985,726,568'Magneto-repulsion punching with dynamic damping'19985,645,673'Lamination process for producing non-planar substrates'19975,635,000'Method for screening using electrostatic adhesion'19975,629,631'Interface card for a probe card assembly'19975,626,778'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing spectrometer verification'19975,620,618'Multi-wavelength programmable laser processing mechanisms and apparatus'19975,618,454'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing design data translation system'19975,546,012'Probe card assembly having a ceramic probe card'19965,541,731'Interferometric measurement and alignment technique for laser scanners'19965,530,371'Probe card assembly'19965,509,556'Process for forming apertures in a metallic sheet'19965,410,233'Magneto-repulsion punching with dynamic damping'19955,404,247'Telecentric and achromatic f-theta scan lens system and method of use'19955,365,211'Wound coil with integral cooling passages'19945,233,624'Method and apparatus for an increased output for a pumped laser using a moving aperture'19935,213,249'Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means'19935,172,388'Method and apparatus for an increased pulse repetition rate for a CW pumped laser'19925,170,929'Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means'19925,168,454'Formation of high quality patterns for substrates and apparatus therefor'19924,962,294'Method and apparatus for causing an open circuit in a conductive line'19904,821,614'Programmable magnetic repulsion punching apparatus'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2021Patents assigned to IBM (154)· patent assignee history
1989–2021Based in Wappingers Falls, NY, US· patent location history
1997–2017Based in Wappinger Falls, NY, US· patent location history
2000Based in Highland Falls, NY, US· patent location history
2008Patents assigned to APPLE COMPUTER (1)· patent assignee history
2012Patents assigned to LONG DAVID C (3)· patent assignee history
2012Patents assigned to CONESKI ANTHONY F (1)· patent assignee history
2012Patents assigned to DOMITROVITS MICHAEL J (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 154 | 1989–2021 |
| LONG DAVID Cself | 3 | 2012 |
| APPLE COMPUTER | 1 | 2008 |
| CONESKI ANTHONY F | 1 | 2012 |
| DOMITROVITS MICHAEL J | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 149 | 1989–2021 |
| Wappinger Falls, New York, US | 4 | 1997–2017 |
| Highland Falls, New York, US | 1 | 2000 |