Inventor
CHIH-WEI LIAO
Inventor
TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Qprimary
H01QAntennas, i.e. radio aerials31%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C08JWorking-up8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
C08LCompositions of macromolecular compounds8%
H05KPrinted circuits8%
G06FElectric digital data processing6%
H01RElectrically-conductive connections4%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
PatentTitleYear
12,585,309Laptop computer with quick-release keyboard202612,555,914Antenna module202612,548,901Electronic device202612,506,264Antenna module and electronic device202512,494,566Electronic device202512,482,923Antenna module and electronic device202512,438,265Antenna and vehicle employing antenna202512,407,086Electronic device202512,355,165Electronic device202512,327,927Electronic device202512,327,907Electronic device202512,166,511Antenna structure and wireless communication device using same202412,142,843Electronic device202411,901,652Antenna with multiple frequency ranges and electronic device202411,827,105Independent-drive set and wheeled vehicle having the same202311,721,886Vehicle antenna capable of operating in multiple frequency ranges and automobile antenna device202311,681,329Electronic device assembly202311,643,544Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same202311,414,532Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same202211,404,770Antenna structure and wireless communication device202211,339,258Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same202211,334,115Electronic device assembly202211,306,239High thermal conductivity prepreg and uses of the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to FUTAIJING PREC ELECTRONICS YANTAI CO LTD (5)· patent assignee history
2022–2023Patents assigned to TAIWAN UNION TECHNOLOGY CORP (4)· patent assignee history
2022–2026Patents assigned to ACER INC (3)· patent assignee history
2022–2026Based in TW· patent location history
2023–2025Patents assigned to HON HAI PREC IND CO LTD (3)· patent assignee history
2024–2026Patents assigned to PEGATRON CORP (10)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PEGATRON CORP | 10 | 2024–2026 |
| FUTAIJING PREC ELECTRONICS YANTAI CO LTD | 5 | 2022–2025 |
| TAIWAN UNION TECHNOLOGY CORP | 4 | 2022–2023 |
| ACER INC | 3 | 2022–2026 |
| HON HAI PREC IND CO LTD | 3 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 23 | 2022–2026 |