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Inventor

LI-TIEN TSENG

Inventor
TW

Overview

4→
Patents
2021–2023
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices38%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems25%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure25%
G01CMeasuring distances, levels or bearings13%
PatentTitleYear
11,802,768MEMS multiaxial angular rate sensor202311,518,673MEMS device and method for manufacturing the same202211,312,624MEMS device and manufacturing method thereof202211,137,296Force sensor with MEMS-based device and force touching member2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2023Patents assigned to MIRAMEMS SENSING TECH CO LTD (4)· patent assignee history
2021–2023Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MIRAMEMS SENSING TECH CO LTD42021–2023
Locations
LocationPatentsSpan
TW42021–2023